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Ю Джозеф Ядро Cortex-M3 компании ARM. Полное руководство Ю Джозеф Ядро Cortex-M3 компании ARM. Полное руководство Новинка

Ю Джозеф Ядро Cortex-M3 компании ARM. Полное руководство

Настоящая книга представляет собой исчерпывающее руководство по новому 32-битному процессору компании ARM - Cortex-M3. В данном руководстве подробно описана архитектура процессорного ядра Cortex-M3 и его подсистемы памяти. Также подробно рассмотрены остальные узлы процессора, в том числе контроллер векторных прерываний NVIC, модуль защиты памяти MMU и разнообразные компоненты отладки. Приводится детальное описание новой системы команд Thumb-2, поддерживаемой данным процессором. Книга содержит большое число примеров программного кода как на языке Си, так и на ассемблере. Это руководство должно присутствовать на столе любого разработчика, использующего в своей работе микроконтроллеры с ядром Cortex-M3. Полнота и ясность изложения материала книги также позволяет рекомендовать её студентам соответствующих специальностей и подготовленным радиолюбителям.
Vincent Mahout Assembly Language Programming. ARM Cortex-M3 Vincent Mahout Assembly Language Programming. ARM Cortex-M3 Новинка

Vincent Mahout Assembly Language Programming. ARM Cortex-M3

8102.04 руб. или Купить в рассрочку!
ARM designs the cores of microcontrollers which equip most “embedded systems” based on 32-bit processors. Cortex M3 is one of these designs, recently developed by ARM with microcontroller applications in mind. To conceive a particularly optimized piece of software (as is often the case in the world of embedded systems) it is often necessary to know how to program in an assembly language. This book explains the basics of programming in an assembly language, while being based on the architecture of Cortex M3 in detail and developing many examples. It is written for people who have never programmed in an assembly language and is thus didactic and progresses step by step by defining the concepts necessary to acquiring a good understanding of these techniques.
Diplomat Ручка Balance B Blue Шариковая Diplomat D20000413 Diplomat Ручка Balance B Blue Шариковая Diplomat D20000413 Новинка

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Ram Charan Boards That Deliver. Advancing Corporate Governance From Compliance to Competitive Advantage Ram Charan Boards That Deliver. Advancing Corporate Governance From Compliance to Competitive Advantage Новинка

Ram Charan Boards That Deliver. Advancing Corporate Governance From Compliance to Competitive Advantage

2117.36 руб. или Купить в рассрочку!
Finally, a book that brings the vision of truly good governance down to earth. Ram Charan, expert in corporate governance and best-selling author, packs this book with useful tools and techniques to take boards and their companies to a higher level of performance. Charan puts his finger on a growing problem for boards: the disconnect between directors' efforts and their results. The added time and attention boards invest is not translating into better governanceâ??that is, governance that adds value to the business. Boards That Deliver gets beyond the rhetoric of corporate governance reform. It captures the tried-and-true practices used by high-performance boards. In contrast to experts who base prescriptions on number-crunching exercises, Charan identifies the real problems that drain directors' time and suppress their best judgmentsâ??and explains clearly and succinctly how boards can solve those problems. These battle-tested solutions help boards achieve what rules and regulations alone cannotâ??to get succession right, refine a winning strategy, and design a rational CEO compensation package. Good governance requires leadership. Boards That Deliver is the no-nonsense guide for directors and CEOs who are rising to the leadership challenge to make their boards a competitive advantage.
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Жидкость для биотуалета Жидкость B-Fresh Blue Жидкость для нижнего бака биотуалета, идеально подходит для людей, которые приезжают на дачу на выходные. Как использовать: добавить 75 мл B-Fresh Blue в нижний бак биотуалета на каждые 10 л объёма бака. Затем добавьте 2-3 литра воды.
Игорь Николаевич Огородников Микропроцессорная техника: введение в cortex-m3. Учебное пособие для вузов Игорь Николаевич Огородников Микропроцессорная техника: введение в cortex-m3. Учебное пособие для вузов Новинка

Игорь Николаевич Огородников Микропроцессорная техника: введение в cortex-m3. Учебное пособие для вузов

Учебное пособие нацелено на формирование у студентов практических навыков разработки и программирования микропроцессорных устройств автоматики физических установок, приборов радиационной безопасности человека и окружающей среды, а также различных приборов биофизического и медицинского назначения.
Джозеф Ю Ядро Cortex-M3 компании ARM. Полное руководство Джозеф Ю Ядро Cortex-M3 компании ARM. Полное руководство Новинка

Джозеф Ю Ядро Cortex-M3 компании ARM. Полное руководство

Настоящая книга представляет собой исчерпывающее руководство по новому 32-битному процессору компании ARM - Cortex-МЗ. В данном руководстве подробно описана архитектура процессорного ядра Cortex-МЗ и его подсистемы памяти. Также подробно рассмотрены остальные узлы процессора, в том числе контроллер векторных прерываний NVIC, модуль защиты памяти MMU и разнообразные компоненты отладки. Приводится детальное описание новой системы команд Thumb-2, поддерживаемой данным процессором. Книга содержит большое число примеров программного кода как на языке Си, так и на ассемблере. Это руководство должно присутствовать на столе любого разработчика, использующего в своей работе микроконтроллеры с ядром Cortex-МЗ. Полнота и ясность изложения материала книги также позволяет рекомендовать её студентам соответствующих специальностей и подготовленным радиолюбителям. Рекомендуем!
Pong Chu P. Embedded SoPC Design with Nios II Processor and VHDL Examples Pong Chu P. Embedded SoPC Design with Nios II Processor and VHDL Examples Новинка

Pong Chu P. Embedded SoPC Design with Nios II Processor and VHDL Examples

10378.49 руб. или Купить в рассрочку!
The book is divided into four major parts. Part I covers HDL constructs and synthesis of basic digital circuits. Part II provides an overview of embedded software development with the emphasis on low-level I/O access and drivers. Part III demonstrates the design and development of hardware and software for several complex I/O peripherals, including PS2 keyboard and mouse, a graphic video controller, an audio codec, and an SD (secure digital) card. Part IV provides three case studies of the integration of hardware accelerators, including a custom GCD (greatest common divisor) circuit, a Mandelbrot set fractal circuit, and an audio synthesizer based on DDFS (direct digital frequency synthesis) methodology. The book utilizes FPGA devices, Nios II soft-core processor, and development platform from Altera Co., which is one of the two main FPGA manufactures. Altera has a generous university program that provides free software and discounted prototyping boards for educational institutions (details at http://www.altera.com/university). The two main educational prototyping boards are known as DE1 ($99) and DE2 ($269). All experiments can be implemented and tested with these boards. A board combined with this book becomes a “turn-key” solution for the SoPC design experiments and projects. Most HDL and C codes in the book are device independent and can be adapted by other prototyping boards as long as a board has similar I/O configuration.
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Объем бака: 2, Использование: для биотуалетов, Родина бренда: Нидерланды, Коды товара производителя: 8710315994254
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B-FRESH BLUEОбъем: 2 лРасщепительДля слива в сточные ямы
Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Новинка

Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

9620.94 руб. или Купить в рассрочку!
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
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Manic Street Preachers - International Blue

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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
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