multi function 21 compartment plastic storage box for electronic components or small gadgets



Kieran Mohammed Mba Principles of Small Business. A Look at Critical Components for Small Business Success Kieran Mohammed Mba Principles of Small Business. A Look at Critical Components for Small Business Success Новинка

Kieran Mohammed Mba Principles of Small Business. A Look at Critical Components for Small Business Success

1514 руб.
Книга "Principles of Small Business. A Look at Critical Components for Small Business Success".
ِAhmed Jaber, Mohammed Tubail, Mohammed Abu Hasna Modelica. Modeling and Simulation Based on Dymola Program ِAhmed Jaber, Mohammed Tubail, Mohammed Abu Hasna Modelica. Modeling and Simulation Based on Dymola Program Новинка

ِAhmed Jaber, Mohammed Tubail, Mohammed Abu Hasna Modelica. Modeling and Simulation Based on Dymola Program

5577 руб.
Bachelor Thesis from the year 2013 in the subject Electrotechnology, grade: A, Islamic University of Gaza, language: English, abstract: Modelica is an object-oriented, declarative, multi-domain language for component-oriented modeling of complex systems, e.g., systems containing mechanical, electrical, electronic, hydraulic, thermal, control, electric power or process-oriented subcomponents. Modelica language is a textual description to define all parts of a model and to structure model components in libraries, called packages. Basically, all Modelica language elements are mapped to differential, algebraic and discrete equations. Using Modelica in design process for complex systems is very efficient and provide several benefits results. In Modelica we can model and simulate all types of components such as electrical, mechanical, hydraulic etc. Furthermore, Modelica Association provide standard library which contains a lot of different components.
Dermot O'Hare Structure from Diffraction Methods. Inorganic Materials Series Dermot O'Hare Structure from Diffraction Methods. Inorganic Materials Series Новинка

Dermot O'Hare Structure from Diffraction Methods. Inorganic Materials Series

9603.03 руб.
Inorganic materials show a diverse range of important properties that are desirable for many contemporary, real-world applications. Good examples include recyclable battery cathode materials for energy storage and transport, porous solids for capture and storage of gases and molecular complexes for use in electronic devices. An understanding of the function of these materials is necessary in order to optimise their behaviour for real applications, hence the importance of 'structure–property relationships'. The chapters presented in this volume deal with recent advances in the characterisation of crystalline materials. They include some familiar diffraction methods, thoroughly updated with modern advances. Also included are techniques that can now probe details of the three-dimensional arrangements of atoms in nanocrystalline solids, allowing aspects of disorder to be studied. Small-angle scattering, a technique that is often overlooked, can probe both ordered and disordered structures of materials at longer length scales than those probed by powder diffraction methods. Addressing both physical principals and recent advances in their applications, Structure from Diffraction Methods covers: Powder Diffraction X-Ray and Neutron Single-Crystal Diffraction PDF Analysis of Nanoparticles Electron Crystallography Small-Angle Scattering Ideal as a complementary reference work to other volumes in the series (Local Structural Characterisation and Multi Length-Scale Characterisation), or as an examination of the specific characterisation techniques in their own right, Structure from Diffraction Methods is a valuable addition to the Inorganic Materials Series.
Siavash Zoroofi Modeling and Simulation of Vehicular Power Systems Siavash Zoroofi Modeling and Simulation of Vehicular Power Systems Новинка

Siavash Zoroofi Modeling and Simulation of Vehicular Power Systems

8789 руб.
Regarding limitation of fossil fuels and the high consumption rate of their energy for transportation, inclination of vehicle industry toward other sources of energy is inevitable. Electric and hybrid vehicles could be a viable solution. This paper presents quasi-state modeling of hybrid power train components including representations of vehicular dynamics, power-electronic drive, electric motors, energy storage, and other mechanical components. A series hybrid transit bus is developed as a case study. The model is validated using fuel consumption data obtained from tests on an actual hybrid bus.
Bazu Marius Failure Analysis. A Practical Guide for Manufacturers of Electronic Components and Systems Bazu Marius Failure Analysis. A Practical Guide for Manufacturers of Electronic Components and Systems Новинка

Bazu Marius Failure Analysis. A Practical Guide for Manufacturers of Electronic Components and Systems

10137.31 руб.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Earl Boysen Electronics Projects For Dummies Earl Boysen Electronics Projects For Dummies Новинка

Earl Boysen Electronics Projects For Dummies

2535.77 руб.
These projects are fun to build and fun to use Make lights dance to music, play with radio remote control, or build your own metal detector Who says the Science Fair has to end? If you love building gadgets, this book belongs on your radar. Here are complete directions for building ten cool creations that involve light, sound, or vibrations – a weird microphone, remote control gizmos, talking toys, and more, with full parts and tools lists, safety guidelines, and wiring schematics. Check out ten cool electronics projects, including * Chapter 8 – Surfing the Radio Waves (how to make your own radio) * Chapter 9 – Scary Pumpkins (crazy Halloween decorations that have sound, light, and movement) * Chapter 12 – Hitting Paydirt with an Electronic Metal Detector (a project that can pay for itself) Discover how to * Handle electronic components safely * Read a circuit diagram * Troubleshoot circuits with a multimeter * Build light-activated gadgets * Set up a motion detector * Transform electromagnetic waves into sound Companion Web site * Go to www.dummies.com/go/electronicsprojectsfd * Explore new projects with other electronics hobbyists * Find additional information and project opportunities
SHUKLA NIKHIL 71 ELECTRICAL & ELECTRONIC PORJECTS SHUKLA NIKHIL 71 ELECTRICAL & ELECTRONIC PORJECTS Новинка

SHUKLA NIKHIL 71 ELECTRICAL & ELECTRONIC PORJECTS

3489 руб.
This book is ideal for high school & engineering students as well as hobbyists who have just started out building projects in Electrical and Electronics fields. The book starts with electrical and electronics fundamentals necessary for execution of projects. The basic knowledge is introduced first followed by a schematic diagram, components list and the theory behind the project to be performed is given. The projects have been divided into three segments corresponding to beginners, intermediate and engineering levels. The materials required to build the projects are commonly available at the corner shop and are less expensive than you think. FeaturesIdeal for beginners, high school (intermediate), engineering students and hobbyistsUseful for knowing basics of electronic components, circuit, and home lab setup.Practical for doing projects at home or school laboratory
Alexander Bachmutsky System Design for Telecommunication Gateways Alexander Bachmutsky System Design for Telecommunication Gateways Новинка

Alexander Bachmutsky System Design for Telecommunication Gateways

10678.86 руб.
System Design for Telecommunication Gateways provides a thorough review of designing telecommunication network equipment based on the latest hardware designs and software methods available on the market. Focusing on high-end efficient designs that challenge all aspects of the system architecture, this book helps readers to understand a broader view of the system design, analyze all its most critical components, and select the parts that best fit a particular application. In many cases new technology trends, potential future developments, system flexibility and capability extensions are outlined in preparation for the longevity typical for products in the industry. Key features: Combines software and hardware aspects of the system design. Defines components and services supported by open-source and commercial basic and extended software platforms, including operating systems, middleware, security, routing, management layer and more. Focuses on disruptive technologies. Provides guidelines for developing software architectures based on multi-threaded, multi-process, multi-instance, multi-core, multi-chip, multi-blade and multi-chassis designs. Covers a number of advanced high-speed interconnect and fabric interface technologies and their commercial implementations. Presents different system form factors from compact pizza-box styles to medium and large bladed systems, including IBM BladeCenter, ATCA and microTCA-based chassis. Describes different mezzanine cards, such as PMC, PrPMC, XMC, AMC and others.
Alexander Bachmutsky System Design for Telecommunication Gateways Alexander Bachmutsky System Design for Telecommunication Gateways Новинка

Alexander Bachmutsky System Design for Telecommunication Gateways

11008.48 руб.
System Design for Telecommunication Gateways provides a thorough review of designing telecommunication network equipment based on the latest hardware designs and software methods available on the market. Focusing on high-end efficient designs that challenge all aspects of the system architecture, this book helps readers to understand a broader view of the system design, analyze all its most critical components, and select the parts that best fit a particular application. In many cases new technology trends, potential future developments, system flexibility and capability extensions are outlined in preparation for the longevity typical for products in the industry. Key features: Combines software and hardware aspects of the system design. Defines components and services supported by open-source and commercial basic and extended software platforms, including operating systems, middleware, security, routing, management layer and more. Focuses on disruptive technologies. Provides guidelines for developing software architectures based on multi-threaded, multi-process, multi-instance, multi-core, multi-chip, multi-blade and multi-chassis designs. Covers a number of advanced high-speed interconnect and fabric interface technologies and their commercial implementations. Presents different system form factors from compact pizza-box styles to medium and large bladed systems, including IBM BladeCenter, ATCA and microTCA-based chassis. Describes different mezzanine cards, such as PMC, PrPMC, XMC, AMC and others.
Xiangping Li Nanoparticle-based multi-dimensional optical data storage Xiangping Li Nanoparticle-based multi-dimensional optical data storage Новинка

Xiangping Li Nanoparticle-based multi-dimensional optical data storage

4914 руб.
The ever increasing demand for high data storage capacity compels the two-photon (2P) excitation based three-dimensional (3D) bit by bit optical data storage system, where the information is recorded as a localized physical or chemical change inside the volume of recording media. Even though the highly confined property of 2P induced optical data storage has led to a higher recording density, it can only reach a theoretical density up to a few Terabytes per disc, which is far below the requirement for the next generation of information storage devices. This book introduces the emerging field of multi-dimensional optical data storage by using the forefront of nanophotonic techniques, which has the potential to revolutionize the information storage and has no theoretical limitation of storage density by employing the physical dimensions of writing beams.
Cherry Bhargava, Shivani Gulati Remaining Useful Life (RUL) Prediction of electrolytic Capacitor using Artificial Intelligence Cherry Bhargava, Shivani Gulati Remaining Useful Life (RUL) Prediction of electrolytic Capacitor using Artificial Intelligence Новинка

Cherry Bhargava, Shivani Gulati Remaining Useful Life (RUL) Prediction of electrolytic Capacitor using Artificial Intelligence

5877 руб.
Master's Thesis from the year 2017 in the subject Engineering - Artificial Intelligence, grade: 9.00, Lovely Professional University, Punjab (Lovely professional university, Punjab), course: M.Tech, language: English, abstract: Residual life prediction is the technique which demonstrates how reliable a particular electronic system or component works under in specific operating conditions. The remaining useful life relies on the failure rate of a component and on the operating conditions of a device. This failure rate drifts for the duration of the life of the item with time. Life is an important aspect while choosing the electronic hardware. Residual life estimation and life prediction are two distinct terms. The importance of life estimation is to evaluate the remaining useful life of a specific component under the different stress parameters. As an increasing number of components are integrated on to a chip, the chances of failure increase, as the different parts have their own stress factors and different working conditions. So the condition monitoring strategies are utilized which enhances the reliability of a component and a suitable move to be made before any harmful breakdown happens. The electronic circuits need a failure estimation technique to protect the system from unavoidable failures.Residual life estimation of electronic components is an important fact these days as electronic components and devices becomes a great need of society. Residual life prediction ...
Raisa P. Kuzmina Soft shells Raisa P. Kuzmina Soft shells Новинка

Raisa P. Kuzmina Soft shells

560 руб.
All rights reserved. This work may not be translated or copied in whole or in part with- out the written permission of the publisher, except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden.
Kinematic Chains and Machine Components Design, Kinematic Chains and Machine Components Design, Новинка

Kinematic Chains and Machine Components Design,

8854 руб.
Kinematic Chains and Machine Components Design,
Gion Kunz Mastering Angular Components Gion Kunz Mastering Angular Components Новинка

Gion Kunz Mastering Angular Components

5202 руб.
Книга "Mastering Angular Components".

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Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
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